IP Profile: Carbon Nanotube-based Thermal Interface Material
A process has been developed to integrate the high thermal conductivity of carbon nanotubes into a polymer matrix, thus creating a material with high thermal transport properties for laser and IC chip packaging.
Market: Electronics
Technology Contact: Keith Ritala, University of Washington, WA, USA
A process has been developed to integrate the high thermal conductivity of carbon nanotubes into a polymer matrix, thus creating a material with high thermal transport properties for laser and IC chip packaging. The University of Washington Technology Transfer Office reports a prototype has been developed, and a patent has been field for this process.
The proprietary process was developed for the semiconductor industry, which the university notes is projected to reach $274 billion in 2007, with packaging materials accounting for approximately $15 billion. The IP has been featured in Electronic Business and Electronic News.
