Authors: N.D. Andrews, J.V. Clark
Affilation: Purdue University, United States
Pages: 207 - 210
Keywords: MEMS, layer thickness, microelectromechanical systems, characterization, test structure
In this work we propose a method to measure the structural layer thickness of MEMS using torsional resonance. The thickness of structures often has measurable influences on the mechanical, thermal, and electrical behaviors. Measurement of layer thickness is often desired for calibration, quality control, and prediction of MEMS performance. This work presents a new model and analysis demonstrating how layer thickness may be measured using the relationship between torsional resonance and cross sectional geometry.
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