Authors: M. Abo Ras
Affilation: Berliner Nanotest and Design GmbH, Germany
Pages: 159 - 163
Keywords: thermal Interface Materials, thermal resistance, thermal conductivity, thermal characterization, reliability test, material aging, TIM delamination, greases pump-out
The on-going need for miniaturization and speed in electronics industry has brought a requirement for better performing thermal management systems. Therefore we have developed a test stand to characterize the aging behaviour of most common thermal interface materials (TIMs).
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