Authors: R. Pufall, B. Michel, E. Kaulfersch
Affilation: Infineon Technology AG, Germany
Pages: 1 - 4
Keywords: adhesion, moulding compound, degradation, accelerated testing
It is well known that high temperature storage can degrade moulding compounds for chip encapsulation to such an extent that the adhesions to surfaces like copper (lead frames) or polyimide (chip coating) decreases drastically causing delamination. Also during normal operation of electronically components heat is generated locally (bond wire, or chip surface) degrading the moulding compound and reducing the adhesion which in extreme cases can destroy the metallisation or bond wires.
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