Thin-Film Deposition on Nanoparticles in Low-Pressure Plasma

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To achieve the desirable optical, mechanical, thermal, and electrical properties that are unattainable in the nanoparticles alone, Matsoukas group uses plasma enhanced chemical vapor deposition technique, PECVD. Particles are introduced into two different reactors that allow us to coat particles in the plasma for different period of time. Introduction of a hydrocarbon at the same time in the plasma reactors results in the formation of a hydrogenated amorphous carbon layer that deposits on the particle surface in the form of a fil. To control the film thickness, we varied plasma exposure time; and found that the growth of the film is linear with time. After synthesizing a core-shell structure, the core is etched by a proper solvent while leaving the amorphous carbon film intact. We also investigate the in vitro dissolution behavior of the core materials (e.g., NaCl and KCl) with different shell thickness to determine the rate of release and encapsulation behavior of the shell.

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Journal: TechConnect Briefs
Volume: 1, Nanotechnology 2010: Advanced Materials, CNTs, Particles, Films and Composites
Published: June 21, 2010
Pages: 693 - 696
Industry sector: Advanced Materials & Manufacturing
Topics: Advanced Materials for Engineering Applications, Coatings, Surfaces & Membranes
ISBN: 978-1-4398-3401-5