Authors: P. Makaram, S. Selvarasah, C. Chen, A. Busnaina and M.R. Dokmeci
Affilation: Northeastern University, United States
Pages: 131 - 133
Keywords: nanotube, 3D, flexible, nanoelectronics, nanoassembly, dielectrophoresis
Single Walled Carbon Nanotubes (SWNTs) with their superior electrical and mechanical properties are very strong candidates for future electronic applications. CMOS electronics are constantly being scaled down to accommodate more devices. Alternative device geometries are being investigated, as scaling of devices cannot be maintained by reducing the geometry alone due to the limitations in gate length and oxide thickness. Alternative device geometries facilitate further miniaturization of devices while providing new platforms for nanoscale devices. We introduce a room temperature route for integrating SWNTs on flexible substrates Flexible electronics is an emerging area of research. Coupled with this area, nanoscale devices specifically in 3D would allow high density miniaturization of future micro and nanoelectromechanical systems as well as 3D microelectronics.3D structures are micromachined on top of a parylene-C substrate. SWNTs are then assembled using dielectrophoresis between top and the bottom metal electrodes, providing a one step method to make 3D SWNT based devices directly on flexible substrate. Electrical measurements of the device demonstrate a linear behavior with a resistance of 900 Ω. This approach is compatible with conventional semiconductor processing and hence will find extensive applications in 3D nanoelectronics, NEMS and nanosensors.
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