Nanotech 2006 Vol. 3
Nanotech 2006 Vol. 3
Technical Proceedings of the 2006 NSTI Nanotechnology Conference and Trade Show, Volume 3

MEMS Device Modeling Chapter 6

Mechanical Properties Measurements of 0.35-µm BiCMOS MEMS Structures
J. Liu, G.K. Fedder, S. Sassolini and N. Sarkar
Carnegie Mellon University, US

MEMS Process Characterization with an on-Chip Device
D. Garmire, H. Choo, R.S. Muller, S. Govindjee and J. Demmel
UC Berkeley, US

Analytic Damping Model for a Square Perforation Cell
T. Veijola
Helsinki University of Technology, FI

Simulations of the Anchor Losses in MEM Disk Resonators
D. Paci, S. Stoffels and H.A.C. Tilmans

Adaptive Control for Reducing the Effect of Damping on the Output Signal of Microgyroscopes
R. Khalilyulin, T. Hauck and G. Wachutka
Munich University of Technology, DE

Microcantilever Sensor via Second Order Sliding Mode Control
J. English, Y. Shtessel, M. Yegnaraman and M. George
University of Alabama in Huntsville, US

Parameterizable Library Components for SAW Devices
W.C. Wilson and G.M. Atkinson
NASA Langley Research Center, US

Strong and Weak Inversion Mode of MOS in the Design of Direction Sensitivity Matrix
M. Husak, A. Boura and J. Jakovenko
Czech Technical University in Prague, CZ

Manipulation of Capillary force by Electrowetting for Micromanipulation
S. Chandra and C. Batur
University of Akron, US

Multiphysics Modeling and Simulation for a MEMS Thermal-Mechanical Switch
W. Wang, R. Popuri, S. Onishi, J. Bumgarner and L. Langebrake
University of South Florida, US

Smart Pressure Sensor on SOI optimized by Finite Element Analysis for Heatspreader Integration
B. Bercu, L. Montès and P. Morfouli

Modelling of Torsional Micromirrors with Springs made of Multiple Rotational Serpentine Elements
J. You, M. Packirisamy and I. Stiharu
Concordia University, CA

Application of a Design Methodology Using a 2D Micro Scanner
O. Anac and I. Basdogan
Koc University, TR

ISBN: 0-9767985-8-1
Pages: 913
Hardcopy: $119.95