Authors: P. Tathireddy, S. Chakravarthy, J. Hsu, M. Klein, H. Oppermann, L. Rieth, R. Harrison, R.A. Normann, F. Solzbacher
Affilation: University of Utah and Fraunhofer Institute, Germany, United States
Pages: 357 - 360
Keywords: flip chip bonding, stacked hybrid integration, electrode arrays, biocompatible
Chronically implantable wireless neural interfaces require biocompatible and stable high density integration of sensing, data processing, communication and power supply. The objective of this research was to develop a biocompatible wafer level integration technology for a stacked hybrid assembly of silicon, polyimide, ceramics and SMD components for the next generation wireless neural interface. The device consists of a 100 channel amplifier, data compression, RF communication, power recovery module, two 60-turn planar coils, SMD components and a Utah Electrode Array (UEA) with metallization on the backside. The coils can be operated as single or switched in parallel or series coils to modify frequency range and voltage gain.
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