Nanotech 2004 Vol. 3
Nanotech 2004 Vol. 3
Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 3

Commercial Tools, Processes and Materials Chapter 11

UV Laser Micro-Materials Processing Of MEMS, Microfluidics, Sensors, LEDs and Other Miniature Devices

Authors: J.P. Sercel

Affilation: JP Sercel Associates, Inc., United States

Pages: 518 - 520

Keywords: MEMS, microfluidics, sensors materials processing

An overview of the types of UV laser processing as applied to the fabrication of miniature devices using advanced UV Excimer and UV DPSS lasers, will be presented. This discussion will include examples of high tolerance laser micromachining processes and an will overview the current technology of short pulse width industrial 266nm diode pumped solid state lasers and short wavelength excimer lasers at 193nm and 157nm. 3D micromachining, heat free etching and thin film patterning will be discussed. Using these relatively new lasers, high accuracy and high production rates are achieved in difficult materials such as fused silica, Teflon, sapphire, ceramics and diamond. Micro vias, die separation, microfluidic nossles, GaN lift off and high resolution thin film patterning processing are demonstrated. Cost effective rapid prototyping and production scale implementation of new micro devices are shown to be possible by the combination of advanced motion control, optics, lasers and software.

ISBN: 0-9728422-9-2
Pages: 561
Hardcopy: $79.95