Docker P.T., Kinnell P.K., Ward M.C.
The University of Birmingham, UK
Keywords: DRIE, Dry release process, Released structures, SOI wafers, STS etching
This paper details a novel method for determining the optimum etch times for releasing structures when using the authors one step dry release process. By using self releasing structures known as waffles the exact point when a device is released can be determined without having to etch numerous chips for different times and sectioning them. This solution allows a worker to determine when a device is released by a simple visual check.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2004 NSTI Nanotechnology Conference and Trade Show, Volume 1
Published: March 7, 2004
Pages: 469 - 472
Industry sectors: Advanced Materials & Manufacturing | Sensors, MEMS, Electronics
Topic: Personal & Home Care, Food & Agriculture
ISBN: 0-9728422-7-6