Nanotech 2003 Vol. 1
Nanotech 2003 Vol. 1
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1

Wafer and MEMS Processing Chapter 13

Wafer-Level High Density Multifunctional Integration (HDMI) for Low-Cost Micro/Nano/Electro-Opto/Bio Heterogeneous Systems

Authors: R.J. Gutmann, J-Q Lu, J.J. McMahon, P.D. Persans, T.S. Cale, E.T. Eisenbraun, J. Castracane and A.E Kaloyeros

Affilation: Rensselaer Polytechnic Institute, United States

Pages: 530 - 533

Keywords: heterogeneous integration, 3D ICs, 3D Integration, wafer bonding, high density multifunctional integration, HDMI

A technology platform -wafer-scale high density multifunctional integration (HDMI) -is described which offers the potential for low-cost integration of information processing and sensor/actuator technologies for future microelectronic, nanoelectronic, mixed electro-optical and bio-molecular systems. The HDMI based upon three-dimensional (3D) wafer-level integration scheme alleviates processing constraints associated with system-on-chip (SoC) electronic integration, while providing the capability of extension to opto-electronic, bio-molecular and other heterogeneous applications, including sensors and actuators. In this presentation the technology platform will be described, status of the process development results obtained to date discussed and approaches to heterogeneous integration outlined. A package assembly envisioned to such HDMI implementations will be discussed, which includes a high density of input/output (I/O) contacts using flip-chip solder bumps or sea-of-leads contacts to a thin film structure.

ISBN: 0-9728422-0-9
Pages: 560