Nanotech 2003 Vol. 1
Nanotech 2003 Vol. 1
Technical Proceedings of the 2003 Nanotechnology Conference and Trade Show, Volume 1

MEMS Design and Application Chapter 11

High Resolution Silicon Accelerometer Using Eutectic Bonding

Authors: Y. Kwang, J.C. Yeon, Y.H. Kim, S.W. Rhee and S.H. Oh

Affilation: Seoul National University, Korea

Pages: 396 - 399

Keywords: microaccelerometer, differential capacitive, Eutectic bonding

High precision micro-accelerometers are used in many applications such as automotives, aviations and aerospace navigation systems. In this paper, a lateral capacitive micro-accelerometer with _g level resolution has been designed and fabricated using simple micromachining process. Large sensing area and large proof mass are important in the design of high precision accelerometer.[1,2] To satisfy these requirements, the differential capacitive comb type is adopted for the sensing part, and the bulk-micromachining is used to define the micro structure. A glass wafer is used to make electrical isolation between the proof mass and electrode. Anchor and gold electrode is pre-defined on the silicon wafer and glass wafer respectively, and bonded each other. Eutectic bonding is used for bonding process of silicon and glass. The role of gold film is not only an adhesion layer but also an electrode layer. The stiction problem which can occur due to wet release process can be removed by using this process. The accelerometer has a 50_m-thick proof mass, 870_m 1027_m in size with 3_m sensing gap defined by deep RIE process. Spring has 3~5_m thickness and 200~300_m length. Proof mass weighs 15.84_gram, and natural frequency is 13.78KHz. This accelerometer is designed to control spring stiffness and force balancing loop to improve resolution.

ISBN: 0-9728422-0-9
Pages: 560