Authors: B.D. Jensen, M.P. de Boer and S.L. Miller
Affilation: Sandia National Laboratory, United States
Pages: 206 - 209
Keywords: optical measurement, material properties, interferometry
An interferometric technique has been developed for non-destructive, high-confidence, in-si tu determination of material properties in MEMS. By using interferometry to measure the full deflection curves of beams pulled toward the substrate under electrostatic loads, the actual behavior of the beams has been modeled. No other method for deter-mining material properties allows such detailed knowledge of device behavior to be gathered. Values for material properties and non-idealities (such as support post compliance) have then been extracted which minimize the error between the measured and modeled deflections. High accuracy and resolution have been demonstrated, allowing the measurements to be used to enhance process control.
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