Applications: Pressure, Actuation, Navigation

Phenomenological Model for Gas Damping of High-Speed Switches

Greywall D.S., Walker J.A., Busch P.A, Arney S.C., Bishop D.J., Boyd G.D., Frigo N.J., Goossen K.W., Iannone P.P., Ruel R.R., Yurke B., Bell Laboratories, Lucent Technologies, Inc., US

This paper discusses a simple phenomenological model of squeeze-film gas damping which has been applied to the design of micromachined optical modulators operating at speeds in excess of 12Mbits/sec. The model is described by analytic [...]

Simulation of the Production of Functional Layers for Vibration Sensors for Tool State Monitoring and Finite Element Analysis of Mechanical Characteristics

Thomas J., Kühnhold R., Schnupp R., Temmel G., Ryssel H., Fraunhofer-Institut fur Integrierte Schaltungen, DE

A novel MEMS vibration sensor for high acceleration am-plitudes was developed in silicon technology for tool state monitoring. According to the application-specific require-ments, the piezoresistive detection of vibration with polysilicon piezoresistors deposited on a thin [...]

Oscillating Diaphragms

McEntee J., Bowman L., McEntee Engineering, US

The manufacture of miniature Stirling cycle cryocoolers, using standard micro-machining techniques and materials has been pursued by the authors [1]. A MEMS based cryocooler would allow integration of a cryogenic cooling system directly into a [...]

Analytical Modelling for Accelerometers with Electrically Tunable Sensitivity

Cretu E., Bartek M., Wolffenbuttel R.F., Delft University of Technology, NL

Results of the analysis and modelling of a pendulum type of accelerometer in an electrostatic field are presented. A common-mode voltage is used to yield an electrostatic positive feedback that amplifies the mechanical sensitivity. The [...]

Modeling and Simulation of Micromachined Gyroscopes in the Presence of Imperfections

Shkel A., Howe R.T., Horowitz R., University of California-Berkeley, US

This paper studies behavior of non-ideal vibratory micromachined gyroscopes. The use of methods of motion decomposition [1] is the essence of the proposed analytical approach. The method is based on partitioning the equations of motion [...]

Simulation and Optimization of Variable Capacitance (VC) Micromotors, Using Modified Parallel-Plate Model

Salman A., Napieralski A., Jablonski G., Technical University of Lodz, PL

This paper presents a new approach for finding the optimal configuration and geometrical dimensions of very small variable capacitance (VC) side drive micromotors based on a modified parallel plate capacitance model The electrostatic drive torque, [...]

Joule Heating Simulation of Poly-Silicon Thermal Micro-Actuators

Silversmith D.J., Reid J.R., Air Force Research Laboratory, US

Previous studies of surface micro-machined polycrystalline silicon MEMS thermal micro-actuators have shown that these simple devices can provide deflections on the order of 10 micrometers at CMOS compatible drive voltages. These thermo-mechanical devices operate by [...]

Fluctuating Amplitudes of Micro-Cantilever Vibration Modes

Greiner A., Fischer M., Korvink J.G., Albert Ludwigs Universitat Frieburg, DE

We investigate fluctuations in the mode amplitudes of vibrating micro mechined cantilevers in a gaseous environment. The movement of a micro-cantilever in thermal equilibrium consists of an superposition of its vibration modes. Each vibrating mode [...]

Modeling and Design Optimization of a CMOS Compatible MEMS

Latorre L., Bertrand Y., Hazard P., Pressecq F., Nouet P., LIRMM-CNRS, FR

Silicon etching at low temperature offers the possibility of manufacturing monolithic sensors with associated electronics. For a given technology, the so-called FSBM, we have established a set of relations to describe the mechanical behavior of [...]

Simulation of Nonideal Behaviour in Integrated Piezoresistive Silicon Pressure Sensors

Romes W., Muchow J., Finkbeiner S., Franz J., Schatz O., Trah H-P., Robert Bosch GmbH, DE

The signal formation in piezoresistive silicon pressure sensors has been studied for many years and is very well understood meanwhile. Nevertheless there are higher order effects of nonideal behaviour such as nonlinearities and hys-teresis effects [...]

Analytical Simulation of a 1D Single Crystal Silicon Electrostatic Micromirror

Camon H., Larnaudie F., Rivoirard F., Jammes B., LAAS/CNRS, FR

This paper is devoted to the study of the static and dynamic behavior of a 1D torsion single crystal silicon micro mirror. Our aim is to develop a parametric model allowing the use of single [...]

Analytical Modeling of Cross-Axis Coupling in Micromechanical Springs

Iyer S., Zhou Y., Mukherjee T., Carnegie Mellon University, US

Analytical models to describe coupling between different directions of motion are derived using energy methods and verified for the U-spring, crab-leg spring and the serpentine spring. Finite element analyses (FEA) are done for a range [...]

Modeling Approach for CVD-Diamond Based Mechanical Structures

Schmid P., Adamschik M., Ertl S., Gluche P., Kohn E., University of Ulm, DE

In this study, mechanical structures based on polycrystalline diamond films grown on silicon substrate are investigated. In contrast to all-silicon MEMS, additional problems arise due to the unusual properties of diamond. These effects are investigated [...]

A New Analytical Solution for Diaphragm Deflection and its Application to a Surface-Micromachined Pressure Sensor

Eaton W.P., Bitsie F., Smith J.H., Plummer D.W., Sandia National Laboratory, US

An analytical solution for large deflections of a clamped circular diaphragm with built-in stress is presented. The solution is directly applicable to micromachined pressure sensors. The solution is compared to finite element analysis results and [...]

Modeling of SiC Lateral Resonant Devices Over a Broad Temperature Range

DeAnna R.G., Roy S., Zorman C.A., Mehregany M., US Army Research Laboratory, US

Finite-element analysis (FEA) modal results of 3C-SiC lateral resonant devices anchored to a Si substrate are presented as resonant frequency versus temperature. The suspended elements are etched from a 2 mm, 3C-SiC film grown at [...]

3-D Finite Element Modeling Schemes for Design and Simulation of VR Microactuator

Mohamed A., El-Hagry M., Electronics Research Institute, EG

This paper describes a 3-D finite element modeling scheme for the designing and analysis of a powerful variable ñ reluctance (VR) microactuator. The device to be modeled having the basic principles of operation of reluctance [...]

Papers: