MSM 99
MSM 99
Technical Proceedings of the 1999 International Conference on Modeling and Simulation of Microsystems

Yield and Reliability Chapter 14

A Simple VLSI Spherical Particle-Induced Yield Predictor
K. Nakamae, H. Ohmori and H. Fujioka
Osaka University, JP

Thermo-Mechanical Simulation of Wire Bonding Joints in Power Modules
S. Ramminger, G. Mitic, P. Türkes and G. Wachutka
Siemens AG, DE

Strength Prediction for MEMS Components Transferring Large Loads
L-H. Chu, Q. Chen and G.P. Carman
University of California, Los Angeles, US

Numerical Fracture Analysis of MEMS Devices
N. Tayebi and A.K. Tayebi
Case Western Reserve University, US

Rapid Reliability Assessment Using CADMP-II
F.P. McCluskey and M. Pecht
University of Maryland, US

Inductive Fault Analysis of a Microresonator
T. Jiang, C. Kellon and R.D. Blanton
Carnegie Mellon University, US

ISBN: 0-9666135-4-6
Pages: 697