MSM 98
MSM 98
Technical Proceedings of the 1998 International Conference on Modeling and Simulation of Microsystems

Thermo-Mechanical Modeling Chapter 4

Reduced Electro-Thermal Models for Integrated Circuits
M. Furmanczyk, A. Napieralski, K. Szaniawski, W. Tylman and A. Lara
Technical University of Lodz, PL

Elements for Modeling Diffused Piezoresistor Temperature Coefficient and Sensitivity
D. Mladenovic, J. Hutchins, E. Tran and S. Lu
Motorola, US

A Least Squares Algorithm for Optimal Heater Placement in Microsensors
C.C. Liu, P.F. Man and C.H. Mastrangelo
University of Michigan, US

Extraction of Dynamic HDL-A Models of Thermally Based Microsystems from Physical Simulations
S. Marco, M. Carmona and J. Samitier
Universitat de Barcelona, ES

Electro-Thermo-Mechanical Simulations of Aluminum Bond Wires in IGBT-Packages
C. Hager, Y. Tronel and W. Fichtner

Thermal Behavior of a V-MCM Package Containing a Thermo-Pneumatic Micropump, Sensors and Integrated Electronics
J. Sieiro, A. Morrissey, M. Carmona, S. Marco, J. Samitier and J. Alderman
Universitat de Barcelona, ES

ISBN: 0-96661-35-0-3
Pages: 678