Nanotech 2002 Vol. 1
Nanotech 2002 Vol. 1
Technical Proceedings of the 2002 International Conference on Modeling and Simulation of Microsystems

Process Modeling Chapter 8

Kinetic Monte Carolo Simulation of Thin Film Growth with Void Formation - Application to via Filling

Authors: Y. Hiwatari, Y. Kaneko, K. Ohara and T. Murakami

Affilation: Kanazawa University, Japan

Pages: 430 - 433

Keywords: Monte Carlo simulation, thin film, voids, via filling

In this paper, we study the void formation during via filling as a model of copper damascene plating for LSI interconnects. We developed a new model for crystal growth which enables us to study the void structure in relation to the surface structure depending upon the deposition conditions. Using this model which we call Solid-by-Solid model, we performed the kinetic Monte Carlo simulations of filling V-shaped and flat-bottomed grooves to examine the surface and void structures during the surface growth. It is found that small voids appear successively in the film, being aligned to the growth direction as the V-shaped groove is filled with deposited atoms. In filling the flat-bottomed groove, on the other hand, large voids appear in the middle of the groove which are elongated to the growth direction. The mechanism of filling and void formation and its dependence on the shape of the initial substrate are discussed.

ISBN: 0-9708275-7-1
Pages: 764