Authors: J. Chen, L. Liu and Z. Li
Affilation: Tsinghua University, China
Pages: 238 - 241
Keywords: corrugation, FEA, couple-field analysis, capacitor, diaphragm
Novel single-chip fabricated condenser structures with corrugated diaphragms for residual stress releasing have been proposed and simulated. An electrostatic-structural coupling FEM analysis has been performed to fully reveal the nonlinear relationship of output electrical signal with respect to input mechanical change. The influence of various nonlinear effects on the performance of transducers is investigated. Two typical corrugation layouts are studied. Numerical results have shown that the round structure was promising with its potential of high sensitivity, while the squared one was superior in the low-voltage applications. The ill effects of these variations can be reduced by delicate design and adjusting of corresponding processes.