Authors: B. Brooks, K. Green, J. Krick, T. Vrotsos and D. Weiser
Affilation: Texas Instruments, United States
Pages: 653 - 656
Keywords: standardization, validation, compact models
The idea of standardizing compact (SPICE-like) models has recently gained momentum in the semiconductor industry. However, since compact model equations reside in software, the concept of standardization is difficult. Several key issues must be addressed, such as accuracy, testing, availability, version control, verification and validation. Most compact models were developed without considering such issues and require productization for the compact model to be useful to the industry. The 1998 SIA Roadmap identified productization as a key issue for 100nm node . With these issues in mind, a group of companies formed the Compact Model Council (CMC), chartered specifically to standardize compact model formulations. The CMC currently has 23 member companies (Table 1), including software vendors and semiconductor suppliers. The current standardization efforts include models for MOSFET (bulk), SOI MOSFET, and Si/SiGe BJT technologies.
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