Authors: M. Rencz, V. Székely and B. Courtois
Affilation: TIMA-CMP, France
Pages: 612 - 615
Keywords: RC compact models, packages, board level thermal simulation tools
The paper presents an algorithm for the co-simulation of packages, given with the RC compact models, and the printed circuit boards. This enables beyond the correct detailed consideration of the heat transfer in the board the calculation of the exact junction temperatures within the packages. Considering individual heat transfer coefficients for each package, or even to each side of the packages, depending on the compact models, is possible. The main advantage is that the methodology keeps the exreme fastness and user friendliness of the board level solvers.
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