Authors: G. Bouche, R. Gonella and E. Sabouret
Affilation: Technology Modeling STMicroelectronics, France
Pages: 442 - 445
Keywords: bonding pad, mechanical stress, simulation, reli-ability, compression test
Introducing new intermetal materials, with improved electrical properties but lowered mechanical resistance, requires in terms of reliability to design new structures for pads. The test structures under fabrication have been simulated to try and evaluate the state of stress under various loads in the structures: the analysis of the results aims at supporting the choice of a specific type of structure and optimizing the parameters of this structure. The present work will help analyze further experimental data under compressive stress.
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