Nanotech 2001 Vol. 1
Nanotech 2001 Vol. 1
Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems

Process Modeling Chapter 9

Bonding Pad Resistance. A Combined Approach

Authors: G. Bouche, R. Gonella and E. Sabouret

Affilation: Technology Modeling STMicroelectronics, France

Pages: 442 - 445

Keywords: bonding pad, mechanical stress, simulation, reli-ability, compression test

Introducing new intermetal materials, with improved electrical properties but lowered mechanical resistance, requires in terms of reliability to design new structures for pads. The test structures under fabrication have been simulated to try and evaluate the state of stress under various loads in the structures: the analysis of the results aims at supporting the choice of a specific type of structure and optimizing the parameters of this structure. The present work will help analyze further experimental data under compressive stress.

ISBN: 0-9708275-0-4
Pages: 638