Krevet B., Kohl M.
Forschungszentrum Karlsruhe, DE
Keywords: finite element method, shapre memory alloy, simulation
This paper presents thermal and mechanical calculations on micro devices driven by electrical heating of a shape memory alloy (SMA). For simulation a program packages has been developed to allow coupling of single task Finite Element Method (FEM) -programs in an arbitrary sequence, which enables the calcuation and optimization of the performance of complex micro systems. Electrical and thermal calculations are performed with the FEM program Tosca, which was extended by the authors to become a time dependent program for thermal analysis. For the mechanical calculation a three dimensional FEM program has been developed, which is based on a two phase model including history effects to describe the shape memory material.
Journal: TechConnect Briefs
Volume: 1, Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems
Published: March 19, 2001
Pages: 282 - 285
Industry sector: Sensors, MEMS, Electronics
Topics: Chemical, Physical & Bio-Sensors, MEMS & NEMS Devices, Modeling & Applications
ISBN: 0-9708275-0-4