Authors: B. Krevet and M. Kohl
Affilation: Forschungszentrum Karlsruhe, Germany
Pages: 282 - 285
Keywords: shapre memory alloy, finite element method, simulation
This paper presents thermal and mechanical calculations on micro devices driven by electrical heating of a shape memory alloy (SMA). For simulation a program packages has been developed to allow coupling of single task Finite Element Method (FEM) -programs in an arbitrary sequence, which enables the calcuation and optimization of the performance of complex micro systems. Electrical and thermal calculations are performed with the FEM program Tosca, which was extended by the authors to become a time dependent program for thermal analysis. For the mechanical calculation a three dimensional FEM program has been developed, which is based on a two phase model including history effects to describe the shape memory material.