Authors: I. Balk and Y. He
Affilation: IntelliSense Corporation, United States
Pages: 64 - 67
Keywords: MEMS, model order reduction, full-wave electromagnetic model, CAD, interconnect, packaging
Progress in MEMS and packaging design has made significant changes in the requirements for modeling tools. In order to design a modern microdevice or interconnect system it is no longer sufficient to limit the analysis to quasielectrostatic modeling due to smaller size and higher operation frequencies of the microdevices. On the other hand, a ‘full-wave’ analysis produces huge systems of equations which require tremendous amounts of computational resources. The method described in this paper is a combination of three-dimensional full-wave coupled RLC electromagnetic analysis and passive Arnoldy based model order reduction algorithm and allows to solve wider range of design problems including miniaturization and high frequency modeling problems.
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