Nanotech 2001 Vol. 1
Nanotech 2001 Vol. 1
Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems

Compact Modeling and Model Order Reduction Chapter 3

New Numerical Techniques and Tools in SUGAR for 3D MEMS Simulation
Z. Bai, D. Bindel, J. Clark, J. Demmel, K. Pister and N. Zhou
University of California Davis, US

Using Scalar Algebraic Multigrid Solvers for Efficient 3-D Stress Analysis of Microfabricated Structures
S. Mijalkovic
Delft University of Technology, LN

Using Pseudo Transient Continuation and the Finite Element Method to Solve the Nonlinear Poisson-Boltzmann Equation
A.I. Shestakov, J.L. Milovich and A. Noy
Lawrence Livermore National Laboratory, US

Experimental Determination of Electrical, Metallurgical, and Physical Gate Lengths of Submicron MOSFET’s
X. Zhou and K.Y. Lim
Nanyang Technological University, SG

Compact Modeling of Avalanche Breakdown in pn-Junctions for Computer-Aided ESD Design (CAD for ESD)
Y. Subramanian and R.B. Darling
University of Washington, US

Compact Modeling and Circuit Impact of a Novel Frequency Dependence of Capacitance in RF MOSFETs
C. Sudhama, K. Joardar, J. Whitfield and A. Zlotnicka
Motorola SPS, US

A New Compact Model of Floating Gate Non-Volatile Memory Cells
L. Larcher, P. Pavan, F. Gattel, L. Albani and A. Marmiroli
Università di Modena e Reggio Emilia, IT

Antiphase Design for Balanced Oscillators
X. Liu, Z. Sheng, C.L. Law, C. Qian and Z. Sun
Nanyang Technological University, SG

Full Wave Electromagnetic Analysis and Model Order Reduction for Complex Three Dimensional Structures
I. Balk and Y. He
IntelliSense Corporation, US

Table-Based Numerical Macromodeling for MEMS Devices
J. Wu and L.R. Carley
Carnegie Mellon University, US

Scalable Macromodels for Microelectromechanical Systems
V. Srinivasan, A. Jog and R.B. Fair
Duke University, US

Compact Model for the Squeezed-Film Damping Including the Open Border Effects
T. Veijola, K. Ruokonen and I. Tittonen
Helsinki University of Technology, FI

A Design Approach for Robustness Improvement of Rate Gyroscopes
C. Acar and A. Shkel
University of California Irvine, US

Boundary Independent Exact Thermal Model for Electronic Systems
Y.C. Gerstenmaier, H. Pape and G. Wachutka
Siemens AG, Corporate Technology, DE

Macromodeling Temperature-Dependent Curl in CMOS Micromachined Beams
S. Iyer, H. Lakdawala, G.K. Fedder and T. Mukherjee
Carnegie Mellon University, US

ISBN: 0-9708275-0-4
Pages: 638