MSM 2000
MSM 2000
Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems

Equivalent Circuits, Behavioral and Multi-Level Simulation Chapter 5

A Method for Thermal Model Generation of MEMS Packages

Authors: M. Rencz, V. Székely, Zs. Kohári and B. Courtois

Affilation: Micred Ltd., Hungary

Pages: 209 - 212

Keywords: reduced order models, thermal models, package models

MEMS applications are frequently thermally operated, so knowing the thermal characteristics of their packages is very important. This paper presents a method for the generation of reduced order dynamic thermal models, either from simulated or from measured transient results. The applicability of the method is presented on a benchmark package used for (pressure) sensor applications.

ISBN: 0-9666135-7-0
Pages: 741