Process Simulation for Contact Print Microlithography

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Using a combination of experiment and simulations, we have studied the conformation of liquid microstructures on both at and corrugated, chemically heterogeneous substrates. The artificial surface patterns, which define regions of different surface energy, induce deformations of the liquid-solid contact line, which can either promote or impede capillary break-up and the formation of bulges. We study numerically the in uence of the adhesion energies on the hydrophilic and hydrophobic surface areas, the pattern geometry and the deposited uid volume on the liquid surface profiles. Moreover, we investigate the transfer of these microscopic ink patterns from the stamp surface to the target substrate during

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Journal: TechConnect Briefs
Volume: Technical Proceedings of the 2000 International Conference on Modeling and Simulation of Microsystems
Published: March 27, 2000
Pages: 28 - 31
Industry sector: Sensors, MEMS, Electronics
Topic: Modeling & Simulation of Microsystems
ISBN: 0-9666135-7-0