Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect
Field-Based 3D Capacitance Modeling for sub-45-nm On-Chip Interconnect
Challenges of Modeling VLSI Interconnects in the DSM Era
Interconnect Modeling for High Speed Digital Circuits - the Role of RLC Coupling
Compact Modeling for RF and Microwave Integrated Circuits
Compact Modeling for RF and Microwave Integrated Circuits
Challenges of Modeling VLSI Interconnects in the DSM Era
Bridging the Legacy and the Smart Grid: the Power Continuity Unit
Development of a Scalelable Interconnection Technology for Nano Packaging
Capacitance Extraction from Complex 3D Interconnect Structures
Transient Electromagnetic Behaviour of Multiply Contacted Interconnects
Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits
Vector Potential Equivalent Circuit for Efficient Modeling of Interconnect Inductance
Scalability and High Frequency Extensions of the Vector Potential Equivalent Circuit (VPEC)
Vector Potential Equivalent Circuit for Efficient Modeling of Interconnect Inductance
Fabrication of Cu-encapsulated Carbon Nanotube Inductors