Index of Affiliations

Helsinki University of Technology

Compact Model for the Squeezed-Film Damping Including the Open Border Effects

Acoustic Impedance Elements Modeling Oscillating Gas Flow in Micro Channels

End Effects of Rare Gas Flow in Short Channels and in Squeezed-Film Dampers

Static Equivalent Circuit Model for a Capacitive MEMS RF Switch

Dynamic Modelling and Simulation of Microelectromechanical Devices with a Circuit Simulation Program

Compact Large-Displacement Model for Capacitive Accelerometer

Model for Flow Resistance of a Rare Gas Accounting for Surface Roughness

Extending the Validity of Existing Squeezed-Film Damper Models with Elongations of Surface Dimensions

A Method for Solving Arbitrary MEMS Perforation Problems with Edge and Rare Gas Effects

Analytic Damping Model for a Square Perforation Cell

Synthesis and Characterization of Silver Nanoparticle Rings Embedded in Glass

Large area optimized thin film nano solar cells on metal sheets

Hewlett Packard Co. Laboratories

Inkjet Assisted Micro-Scale Cooling of Electronics

Hewlett Packard Laboratories

Resolution Enhancement in Nanoimprinting by Surface Energy Engineering

Hielscher Ultrasonics

Ultrasonically-Assisted Preparation and Functionalization of Graphene

Ultrasonic Milling and Dispersing Technology for Inkjet Nano-Particles

Hielscher Ultrasonics GmbH

Innovative Use of Ultrasound in the Production of High-Performance Coatings

High Performance Technologies, Inc.

Multiscale Detection of Temporal Features in Molecular Dynamics Simulations:Applications to Acceleration Methods


Offshore Renewable Resources – Improving the Cost-of-Energy

HiperSem Inc.

Castellated-Gate MOSFETs as Power Transistors for Nanometer CMOS and Post-CMOS Integrated Nanosystems