2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

Partnering Events:

TechConnect Summit
Clean Technology 2008

3D Nanostructured Silicon Relying on Hard Mask Engineering for High Temperature Annealing (HME-HTA) Processes for Electronic Devices

M. Bopp, P. Coronel, F. Judong, K. Jouannic, A. Talbot, D. Ristoiu, C. Pribat, N. Bardos, F. Pico, M.P. Samson, P. Dainesi, A.M. Ionescu, T. Skotnicki
Ecole Polytechnique Fédérale de Lausanne, CH

silicon high temperature annealing, hard mask, buried cavity, Independant double gate transistor

Annealing silicon at high temperatures in hydrogen ambiance has been reported to induce surface diffusion of silicon; in these conditions, adapted 2D arrays of trenches etched in Bulk Si are transformed into buried cavities creating suspended membranes. A 3D nanostructuration of silicon through hard mask engineering and high temperature annealing in hydrogen ambiance is reported. By using a nitride-oxide hard mask stack instead of a sacrificial oxide hard mask for a free surface (maskless) annealing, we open new technological and design possibilities using 2D arrays of various geometry trenches. Implications and potential device applications are discussed.

Nanotech 2008 Conference Program Abstract