2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual

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TechConnect Summit
Clean Technology 2008

The Roadmap for Non-Destructive Nano Evaluation (nanoEVA) for electronic devices

N. Meyendorf, B. Koehler, F. Schubert, H. Heuer
Fraunhofer-Institut für Zerstörungsfreie Prüfverfahren, DE

non destructive testing, nanoscale

New concepts in assembly and packaging technology for electronic products enables new complex sensor systems e.g. which can be used for structural health monitoring applications. In future times it will be possible to integrate sensor systems directly into the ultra light fibre composite structures of an aircraft or wind power plans. Such structure integrated sensor systems for monitoring of complex technical systems from aircraft, pipelines or wind-powered devices must fulfil highest requirements on lifetime and reliability. After integration into the structure the electronic device will be no longer accessible for maintenance or repair. The sensor systems must guarantee a lifetime at least the time of use of an aircraft or pipeline of about 30 years. With increasing complexity the effort of process control and non destructive testing for assembly and packaging techniques (3D stacking, thru silicon vias, polymer embedded electronics) will increase exponentially. This leads to a rising importance of inspection technique to guarantee yield and quality. Comparably with processes in the semiconductor technology also in the assembly technology the process integrated inspection technique will play a major role and will become a crucial factor for economical success. State of the art non destructive testing methods for packaging and assembling technology are X-ray microscopy, X-ray tomography, scanning ultrasonic microscopy and thermography. Future inspection system must perform a resolution in volume below one µm and should run fast and robust enough for integration into production environment. The paper describes recent progress in several relevant NDT methods.

Nanotech 2008 Conference Program Abstract