2008 NSTI Nanotechnology Conference and Trade Show - Nanotech 2008 - 11th Annual
Technical Conferences
Merck Corporate Needs
NanoInk Symposium
Nano Electronics & Photonics
Nano Fabrication
Sensors & Systems
Micro & Nano Fluidics
MSM - Modeling Microsystems
WCM - Compact Modeling
Nanostructured Materials & Devices
Soft Nanotechnologies & Applications
Nanoparticles in Soft Materials - Colloidal Systems
Polymer Nanotechnology
Carbon Nano Structures & Devices
Nano Particles & Applications
Nanostructured Surfaces and Interfaces
Nanoscale Characterization
Energy Technologies & Applications
Nanotech in Health, Environment & Society
ICCN - Nanoscale Modeling
Bio Nano Materials & Tissues
Bio Sensors & Diagnostics
Biomarkers & Nanoparticles
Cancer Diagnostics, Imaging & Treatment
Drug Delivery & Therapeutics
Nano Medicine
Nanotech to Neurology
Phage Nanobiotechnology
Clean Technology 2008
Industrial Impact Workshop
Confirmed Speakers
Program Committee

Partnering Events:

TechConnect Summit
Clean Technology 2008

11th International Conference on

Modeling and Simulation of Microsystems

MSM 2008

June 1 - 5, 2008
Hynes Convention Center
Boston, Massachusetts, U.S.A

An Interdisciplinary Integrative Forum on
Modeling, Simulation and Scientific Computing in the MEMS, Microelectronic,
Semiconductor, Sensors, Materials and Biotechnology fields.


Confirmed Invited Speakers

Jerry Hallmark
Technologies for Portable Electronics
Jerry Hallmark
Manager - Energy System Technologies
Motorola - Mobile Devices

Symposium Sessions


Monday June 2


Tuesday June 3

8:30 Keynote: Micro Systems: Sensors & Systems: MSM
10:30 Micro Systems: Micro-Nano Integration
 Micro Systems: MEMS & NEMS
 Micro Systems: MSM
3:30 Micro & Nano Fluidics: Devices & Applications - 1
3:30 Micro Systems: Healthcare & Well-being Requirements for NEMS & MEMS

Wednesday June 4

10:30 Micro & Nano Fluidics: Devices & Applications -2
10:30 Sensors & Systems: Applications - 1
10:30 Micro Systems: MSM: Device Modeling, Design & Characterization
1:30 Micro & Nano Fluidics: Transport
1:30 Micro Systems: MEMS & NEMS
4:00 Micro & Nano Fluidics: Design & Simulation
4:00 Sensors & Systems: Applications - 2

Thursday June 5

8:30 Micro Systems: MSM: Simulation Methods and Models
10:30 Micro Systems: MSM: Device & Circuit Simulation

Symposium Program


Tuesday June 3

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8:30 Keynote: Micro Systems: Sensors & Systems: MSMRoom 200
 Session chair: Chris Menzel, Dimatix, Inc.
8:30 NASA NDE Applications for Mobile MEMS Devices and Sensors
W.C. Wilson, NASA Langley Research Center, US
9:00 Nano-Technology for Heterogeneous System Integration
R. Aschenbrenner, K.-D. Lang, H. Reichl, Fraunhofer Institute for Reliability and Microintegration, DE
9:30 Distributed Acoustic Sensing
L. Girod, Massachusetts Institute of Technology, US
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10:30 Micro Systems: Micro-Nano IntegrationRoom 200
 Session chair: Larz Heinze, VDI/VDE Innovation + Technik GmbH, DE
10:30 Silicon on ceramics - a new concept for micro-nano-integration on wafer level
M. Fischer, H. Bartsch de Torres, B. Pawlowski, M. Mach, R. Gade, S. Barth, M. Hoffmann, J. Müller, Technische Universität Ilmenau, DE
10:50 Micro to Nano – Scaling Packaging Technologies for Future Microsystems
T. Braun, K.-F. Becker, J. Bauer, F. Hausel, B. Pahl, O. Wittler, R. Mrossko, E. Jung, A. Ostmann, M. Koch, V. Bader, C. Minge, R. Aschenbrenner, H. Reichl, Technical University Berlin, DE
11:10 Advanced Adhesives based on Carbon Nanotube Technology
H.-J. Fecht, A. Caron, L. Kroner, F. Hennrich, A. Leson, B. Michel, M. Werner, Ulm University, DE
11:30 Contact-free Handling of Metallic Submicron and Nanowires for Microelectronic Packaging Applications
S. Fiedler, M. Zwanzig, M.S. Jäger, M. Böttcher, Fraunhofer Institute for Reliability and Microintegration, DE
11:50 Wireless Integrated Neural Interface Device for Chronic Neural Signal Recording
S. Kim, P. Tathiereddy, L. Rieth, R. Harrison, F. Solzbacher, University of Utah, US
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Micro Systems: MEMS & NEMSExhibit Hall C
- Modeling of Microcantilever based Nuclear Microbatteries
B.G. Sheeparamatti, J.S. Kadadevarmath, R.B. Sheeparamatti, Basaveshwar Engineering College, IN
- Shape Memory Alloy and Elastomer Composite MEMS Actuators
P.D. Fallon, A.P. Gerratt, B.P. Kierstead, R.D. White, Tufts University, US
- A Bridged µLane System for Molecular Diffusivity Measurement and Cell Response Analysis
Q. Kong, M. Vazquez, City College of New York, US
- Acoustic Casimir forces for MEMS actuation
R. Esquivel-Sirvent, L. Reyes Galindo, Instituto de Fisica, UNiversidad Nacional Autonoma de MExico, MX
- A Novel Uncooled IR Imaging Micro-Cantilever Pixel Bimaterial Structure with Optical Interferometric Readout
B. Sun, cape peninsula University of technology, ZA
- Development of A 4X4 Hybrid Optical Switch
B.T. Liao, Y.J. Yang, National Taiwan University, TW
- Stacked Coupled-Disk MEMS Resonators for RF Applications
K.H. Nygaard, C. Grinde, T.A. Fjeldly, Norwegian University of Science and Technology, NO
- Evidence of the Existence of Complete Phononic Band Gaps in Phononic Crystal Plates
S. Mohammadi, A.A. Eftekhar, A. Khelif, W.D. Hunt, A. Adibi, Georgia Institute of Technology, US
- Design and fabrication of high sensitivity 2-axis MEMS gyro sensor by frequency matching of driving and sensing motion
J-Y Kim, M-K Kim, T. An, P.K. Kim, J. Rhim, G.B. Lim, Pohang University of Science and Technology, KR
- Detection of Plant Cell Compartments and Changes in Cell Dielectric due to Arsenic Absorption via Traveling Wave Dielectrophoresis
S. Bunthawin, P. Wanichapichart, A. Tuantranont, Membrane Science and Technology Research Center, TH
- Experimental Evaluation of a Novel Piezoresistive MEMS Strain Sensor for Wireless Structural Health Monitoring Applications
A.A.S. Mohammed, W.A. Moussa, E. Lou, University of Alberta, CA
- Fabrication of nanoscale nozzle for electrostatic field induced inkjet head and test of drop-on-demand operation
V.D. Nguyen, D. Byun, S. Bui, Q. Tran, M. Schrlau, H.H. Bau, S. Lee, Konkuk University, KR
- New Approach for Successful HF Vapour Etching for MEMS release applications
A. Atherton, T. O’Hara, G. Pringle, M. Leavy, Senior Technologist, US
- Non traditional dicing of MEMS devices
S. Sullivan, T. Yoshikawa, DISCO Corp., JP
- A method for electronically controlling electrode position in neural recordings
H.P. Neves, T. Torfs, R.F. Yazicioglu, J. Aslam, A. Aarts, P. Merken, C. Van Hoof, Interuniversity Microelectronics Center, BE
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Micro Systems: MSMExhibit Hall C
- Finite Element Analysis of a MEMS-Based High G Inertial Shock Sensor
Y.P. Wang, R.Q. Hsu, C.W. Wu, National Chiao Tung University, TW
- Design for Manufacturing integrated with EDA Tools
U. Triltsch, S. Büttgenbach, Technical University of Braunschweig, DE
- Modeling Voids in Silicon
M. Hasanuzzaman, Y.M. Haddara, A.P. Knights, McMaster University, CA
- Modeling Germanium-Silicon Interdiffusion in Silicon Germanium/Silicon Super Lattice Structures
M. Hasanuzzaman, Y.M. Haddara, A.P. Knights, McMaster University, CA
- Effect of Strain on the Oxidation Rate of Silicon Germanium Alloys
M.A. Rabie, S. Gou, Y.M. Haddara, A.P. Knights, J. Wojcik, P. Mascher, McMaster University, CA
- A Physics-Based Empirical Model for Ge Self Diffusion in Silicon Germanium Alloys
M.A. Rabie, Y.M. Haddara, McMaster University, CA
- Assessment of L-DUMGAC MOSFET for High Performance RF Applications with Intrinsic Delay and Stability as Design Tools
R. Chaujar, R. Kaur, M. Saxena, M. Gupta, R.S. Gupta, Semiconductor Devices Research Laboratory, IN
- A Continuous yet Explicit Carrier-Based Core Model for the Long Channel Undoped Surrounding-Gate MOSFETs
L. Zhang, J. He, F. Liu, J. Zhang, J. Feng, C. Ma, Peking University, CN
- Diode Parameter Extraction by a Linear Cofactor Difference Operation Method
C. Ma, B. Li, Y. Chen, L. Zhang, F. Liu, J. Feng, J. He, X. Zhang, Peking University, CN
- A Complete Analytic Surface Potential-Based Core Model for Undoped Cylindrical Surrounding-Gate MOSFETs
J. He, J. Zhang, L. Zhang, C. Ma, M. Chan, Peking University, CN
- A Novel Dual Gate Strained-Silicon Channel Trench Power MOSFET For Improved Performance
R.S. Saxena, M.J. Kumar, Indian Institute of Technology, New Delhi, IN
- Pre-Distortion Assessment of Workfunction Engineered Multilayer Dielectric Design of DMG ISE SON MOSFET
R. Kaur, R. Chaujar, M. Saxena, R.S. Gupta, Semiconductor Devices Research Laboratory, IN
- Linearity Performance Enhancement of DMG AlGaN/GaN High Electron Mobility Transistor
S.P. Kumar, A. Agrawal, R. Chaujar, M. Gupta, R.S. Gupta, Semiconductor Device Research Laboratory, IN
- Formal Verification of a MEMS Based Adaptive Cruise Control System
S. Jairam, K. Lata, S. Roy, N. Bhat, Texas Instruments India Pvt Ltd., IN
- High-Frequency Characteristic Optimization of Heterojunction Bipolar Transistors
Y. Li, C-H Hwang, Y-C Chen, National Chiao Tung University, TW
- From MEMS to NEMS: Modelling and characterization of the non linear dynamics of resonators, a way to enhance the dynamic range
N. Kacem, S. Hentz, H. Fontaine, V. Nguyen, M.T. Delaye, H. Blanc, P. Robert, B. Legrand, L. Buchaillot, N. Driot, R. Dufour, CEA, FR
- Modeling and simulation of a monolithic self-actuated microsystem for fluid sampling and drug delivery
P. Zhang, G.A. Jullien, University of Calgary, CA
- ƒn
C.B. Doody, J.S. Wadhwa, D.F. Lemmerhirt, R.D. White, Tufts University, US
- Modeling and Simulation of New Structures for Sub-millimeter Solid-state Accelerometers with Piezoresistive Sensing Elements
R. Amarasinghe, D.V. Dao, S. Sugiyama, Ritsumeikan University, JP
- Simulation of Constant-Charge Biasing Integrated Circuit for High Reliability Capacitive RF MEMS Switch
K.H. Choi, J-B. Lee, C.L. Goldsmith, The University of Texas at Dallas, US
- Vibration-Actuated Bistable Micromechanism for Microassembly
H-T Pham, D-A Wang, National Chung Hsing University, TW
- Stress-induced Effects on the Depletion Layer Capacitance of Silicon
K. Matsuda, Y. Kanda, Y. Itoh, Tokushima Bunri University at Kagawa, JP
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3:30 Micro & Nano Fluidics: Devices & Applications - 1Room 200
 Session chair: Daniel Attinger, Columbia University, US
3:30 Integrated Thermal Modulation and Deflection of Viscous Microjets with Applications to Continuous Inkjet Printing
E.P. Furlani, K.C. Ng, A.G. Lopez, C. Anagnostopoulos, Eastman Kodak, US
3:50 High resolution spatio-temporal dosing of subcellular targets
S. Moorjani, R. Nielson, X.A. Chang and J.B. Shear, University of Texas at Austin, US
4:10 Micro bioreactor for muliwell plates with an active micro fluidic system for 3D cultivation
F. Weise, C. Augspurger, M. Klett, A. Schober, Technische Universität Ilmenau, DE
4:30 Discrete Volume Controllable Microdispenser Module
S. Lee, J. Lee, Seoul National University, KR
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3:30 Micro Systems: Healthcare & Well-being Requirements for NEMS & MEMSRoom 205
 Session chair: Alberto Sanna, Marco Nalin, Scientific Institute H San Raffaele, IT
3:30 Micro-nano-bio convergence systems for biomedical applications: State of the art and Future perspectives under the EC-ICT
M. Willems, IMEC, BE
4:00 Healthcare & Well-being Requirements and Trends
A. Sanna, Scientific Institute H San Raffaele - Milan, IT
4:20 Nanotechnologies for Mobile Innovation: the Telco Operator perspective
M. Turolla, Telecom Italia - Turin, IT
4:40 Developing Smart Interactive Robotic Companions to Improve the Daily Lives of Children in Hospitals
D. Stiehl, MIT, US
5:00 Ambient Assisted Living for independent Living of Elderly People
S. Guillén, ITACA Institute, ES

Wednesday June 4

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10:30 Micro & Nano Fluidics: Devices & Applications -2Room 208
 Session chair: Daniel Attinger, Columbia University, US
10:30 Generation of picoliter and nanoliter drops on-demand in a microfluidic chip
J. Xu, D. Attinger, Columbia University, US
10:50 Hollow Atomic Force Microscopy Probes for Nanoscale Dispensing of Liquids
A. Meister, J. Przybylska, P. Niedermann, C. Santschi, H. Heinzelmann, CSEM SA, CH
11:10 Electrostatic Induced Inkjet Printing System for Micro Patterning and Drop-On-Demand Jetting Characteristics
J. Choi, Y-J. Kim, S.U. Son, Y. Kim, S. Lee, D. Byun, H.S. Ko, Sungkyunkwan University, KR
11:30 A Novel Parallel Flow Control (PFC) System for Syringe-Driven Nanofluidics
H. Liang, W.J. Nam, S.J. Fonash, The Pennsylvania State University, US
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10:30 Sensors & Systems: Applications - 1Room 310
 Session chair: Cy Wilson, NASA, US
10:30 MEMS Pressure Sensor Array for Aeroacoustic Analysis of the Turbulent Boundary Layer on an Airplane Fuselage
J.S. Krause, R.D. White, M.J. Moeller, J.M. Gallman, R. De Jong, Tufts University, US
10:50 Building Micro-Robots: A path to sub-mm3 autonomous systems
J.R. Reid, V. Vasilyev, R.T. Webster, US Air Force Research Laboratory, US
11:10 Pressure sensor data processing for vertical velocity measurement
M. Husak, J. Jakovenko, L. Stanislav, Czech Technical University in Prague, CZ
11:30 Adaptive Subband Filtering Method for MEMS Accelerometer Noise Reduction
P. Pietrzak, B. Pekoslawski, M. Makowski, A. Napieralski, Technical University of Lodz, PL
11:50 Microsystems on their Way to Smart Systems
L. Heinze, VDI/VDE Innovation + Technik GmbH, DE
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10:30 Micro Systems: MSM: Device Modeling, Design & CharacterizationRoom 311
 Session chair: Chris Menzel, Dimatix, Inc.
10:30 Bulk-Titanium Waveguide – a New Building Block for Microwave Planar Circuits
X.T. Huang, S. Todd, C. Ding, N.C. MacDonald, University of California at Santa Barbara, US
10:50 Humidity sensing properties of poly(o-anisidine)/SnO2 composites as revealed by impedance spectroscopy
D. Patil, P. Patil, North Maharashtra University, IN
11:10 The static behavior of RF MEMS capacitive switches in contact
H.M.R. Suy, R.W. Herfst, P.G. Steeneken, J. Stulemeijer and J.A. Bielen, NXP Semiconductors Research, NL
11:30 Modeling and Design of Electrostatic Voltage Sensors Based on Micromachined Torsional Actuators
J. Dittmer, A. Dittmer, R. Judaschke, S. Büttgenbach, Technische Universität Braunschweig, DE
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1:30 Micro & Nano Fluidics: TransportRoom 208
 Session chair: Daniel Attinger, Columbia University, US
1:30 Fabrication and Characterization of Thermo-pneumatic Peristaltic Micropumps
H-H Liao, W-C Liao, Y-J Yang, National Taiwan University, TW
1:50 Discrete Mixing of Nanoliter Drops in Microchannels
M. Rhee, M.A. Burns, University of Michigan, US
2:10 Modeling Magnetic Transport of Nanoparticles with Application to Magnetofection
E.P. Furlani, K.C. Ng, University at Buffalo, US
2:30 Micron Particles Segregation in Lower Electric Field Regions in Very Dilute Neutrally Buoyant Suspensions
Z.Y. Qiu, Y. Shen, S. Tada, D. Jacqmin, The City College of New York, US
2:50 Limitations of DNA High-frequency Anchoring and Stretching
H. Dalir, T. Nisisako, T. Endo, Y. Yanagida, T. Hatsuzawa, Tokyo Institute of Technology, JP
3:10 A High Throughput Multi-stage, Multi-frequency Filter and Separation Device based on Carbon Dielectrophoresis
R. Martinez-Duarte, J. Andrade-Roman, E. Collado-Arredondo, S.O. Martinez, M. Madou, University of California, Irvine, US
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1:30 Micro Systems: MEMS & NEMSRoom 311
 Session chair: Ed Furlani, Kodak, US
1:30 Micro-Tip Assembled Metal Cantilevers with Bi-Directional Controlability
H. Kwon, M. Nakada, Y. Hirabayashi, A. Higo, M. Ataka, H. Fujita, H. Toshiyoshi, KAST, JP
1:50 Novel synchronous linear and rotatory micro motors based on polymer magnets with organic and inorganic insulation layers
M. Feldmann, A. Waldschik, S. Büttgenbach, Institut for Microtechnology (IMT), DE
2:10 A novel high-sensitivity resonant viscometer realised through the exploitation of nonlinear dynamic behaviour
W.H. Waugh, B.J. Gallacher, J.S. Burdess, Newcastle University, UK
2:30 Ultra-thin gold membrane transducer
Y. Kim, M. Cha, H. Kim, S. Lee, J. Shin, J. Lee, Seoul National University, KR
2:50 Micromachined Force Sensors for Characterization of Chemical Mechanical Polishing
D. Gauthier, A. Mueller, R. White, V. Manno, C. Rogers, S. Anjur, M. Moinpour, Tufts University, US
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4:00 Micro & Nano Fluidics: Design & SimulationRoom 208
 Session chair: Ed Furlani, Kodak, US
4:00 Optimizing Multiscale Networks for Transient Transport in Nanoporous Materials
R.H. Nilson, S.K. Griffiths, Sandia National Laboratories, US
4:20 Ultrasound-driven viscous streaming, modelled via momentum injection
J. Packer, D. Attinger, Y. Ventikos, University of Oxford, UK
4:40 Fluidic and Electrical Characterization of 3D Carbon Dielectrophoresis with Finite Element Analysis
R. Martinez-Duarte, E. Collado-Arredondo, S. Cito, S.O. Martinez, M. Madou, University of California, Irvine, US
5:00 The Immersed Surfaces Technology for Reliable and Fast Setup of Microfluidics Simulation Problems
M. Icardi, D. Caviezel, D. Lakehal, ASCOMP GmbH, CH
5:20 Design and Simulations of a Microfluidic Pump with Multiple Vibrating Membranes
K. Koombua, R.M. Pidaparti, P.W. Longest, G.M. Atkinson, Virginia Commonwealth University, US
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4:00 Sensors & Systems: Applications - 2Room 308
 Session chair: Cy Wilson, NASA, US
4:00 A 20 µm Movable Micro Mobile
J. Jeon, J.-B. Lee, M.J. Kim, The University of Texas at Dallas, US
4:20 Development of Active Systems for Military Utilization
J.L. Zunino III., H.C. Lim, US Army ARDEC, US
4:40 Sensing Weak Magnetic Field By Leaving Biosystems and A Magnetoreseption Mechanism For Navigation
S.E. Lyshevski, Rochester Institute of Technology, US

Thursday June 5

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8:30 Micro Systems: MSM: Simulation Methods and ModelsRoom 312
 Session chair: Rafal Romanowicz, NSTI, US
8:30 Fast Methods for Particle Dynamics in Dielectrophoretic and Oscillatory Flow Biochips
I. Chowdhury, X. Wang, V. Jandhyala, University of Washington, US
8:50 High-Stability Numerical Algorithm for the Simulation of Deformable Electrostatic MEMS Devices
X. Rottenberg, B. Nauwelaers, W. De Raedt, D. Elata, IMEC, BE
9:10 Physically-Based High-Level System Model of a MEMS-Gyroscope for the Efficient Design of Control Algorithms
R. Khalilyulin, G. Schrag, G. Wachutka, Munich University of Technology, DE
9:30 Towards an efficient multidisciplinary system-level framework for designing and modeling complex engineered microsystems
J.V. Clark, Y. Zeng, P. Jha, Purdue University, US
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10:30 Micro Systems: MSM: Device & Circuit SimulationRoom 312
 Session chair: Chris Menzel, Dimatix, Inc., US
10:30 Anomalous Thermomechanical Softening-Hardening Transitions in Micro-oscillators
T. Sahai, R. Bhiladvala, A. Zehnder, Cornell University, US
10:50 Test ASIC for Real Time Estimation of Chip Temperature
M. Szermer, Z. Kulesza, M. Janicki, A. Napieralski, Technical Univiversity of Lodz, PL
11:10 Simulation of Field-Plate Effects on Lag and Current Collapse in GaN-based FETs
K. Itagaki, A. Nakajima, K. Horio, Shibaura Institute of Technology, JP
11:30 First self-consistent thermal electron- phonon simulator
D. Vasileska, K. Raleva, S.M. Goodnick, Arizona State University, US
11:50 Structure Generation for the Numerical Simulation of Nano-Scaled MOSFETs
C. Kernstock, M. Karner, O. Baumgartner, A. Gehring, S. Holzer, H. Kosina, Global TCAD Solutions, AT

Announcement and Call for Participation

The largest gathering in the field worldwide, MSM is the premier technical forum for presenting the latest research and development in design, modeling and simulation methods, tools and applications in the MEMS, microelectronic, semiconductor, sensor, materials and biotechnology fields.

The Nanotech 2008 Meeting, MSM & ICCN Conferences, and the WCM workshop will be held at the Santa Clara Convention Center, Santa Clara, California, U.S.A., in the heart of the silicon valley.

The conference Technical Proceedings, consisting of articles submitted by authors of both oral and poster presentations will, be distributed to participants at registration.

In addition to the Technical Program, an exciting series of Social Events are being prepared to allow attendees ample opportunity to interact socially and enjoy the sights and sounds of the venue.


The goal of MSM is to bring together researchers, designers, programmers and vendors involved in microsystem developments (MEMS microelectronic, semiconductor, sensor, materials and biotechnology fields). In an effort to dramatically shorten development time and reduce prototyping costs, simulation activities have experienced phenomenal growth, generating a large number of point solutions, as well as integrated tools.

MSM provides a forum for microsystem simulation specialists, allowing them to be exposed to the state of the art modeling techniques currently implemented in academic or industrial research, encouraging a free exchange of ideas and generating synergies between adjacent specialties. Finally, MSM strives to help advanced modeling techniques diffuse into industry and research centers by organizing workshops, demonstrations and short courses.

Topics and Application Areas



  • Mathematical Modeling and Scaling Laws
  • Numerical Methods
  • Finite and Boundary Element Methods
  • Process, Device and Circuit Simulation
  • Model Calibration, Validation and Metrology
  • Equipment Modeling
  • Co-simulation and Optimization
  • System and Multi-level Modeling
  • Characterization and Reliability
  • Data Bases, Data Exchange and Translators

Application Areas:

  • Semiconductors and Microelectronics
  • Quantum Effects, Quantum Devices and Spintronics
  • Advanced Packaging and Interconnects
  • Micro Electro Mechanical Systems (MEMS)
  • Smart Sensors and Structures
  • Advanced Lithography and Photonics
  • Biotechnology
  • Genomics & Proteomics
  • Microfluidics & Lab on Chip
  • High Throughput Screening
  • Point of Care Diagnostics
  • Electromagnetics, RF, Compact Modeling and Signal Integrity
  • Artificial Intelligence and Expert Systems

Conference Organization


Technical Program Chairs

Matthew Laudon, NSTI, USA
Bart Romanowicz, NSTI, USA

Microsystems Chair

Narayan R. Aluru, University of Illinois Urbana-Champaign, USA

Semiconductor Chair

Andreas Wild, Freescale Semiconductor, USA

Program Committee

Xavier J. R. Avula, Washington University, USA
Stephen F. Bart, Bose Corporation, USA
Bum-Kyoo Choi, Sogang University, Korea
Bernard Courtois, TIMA-CMP, France
Peter Cousseau, Honeywell, USA
Robert W. Dutton, Stanford University, USA
Gary K. Fedder, Carnegie Mellon University, USA
David K. Ferry, Arizona State University, USA
Toshio Fukuda, Nagoya University, Japan
Elena Gaura, Coventry University, UK
Steffen Hardt, Leibniz Universität Hannover, Germany
Andreas Hieke, Ciphergen Biosystems, Inc., USA
Eberhard P. Hofer, University of Ulm, Germany
Charles H. Hsu, MaxiMEM Limited, USA
Michael Judy, Analog Devices, USA
Yozo Kanda, Toyo University, Japan
Jan G. Korvink, University of Freiburg, Germany
Anantha Krishnan, Defense Advanced Research Projects Agency, USA
Mark E. Law, University of Florida, USA
Mary-Ann Maher, SoftMEMS, USA
Kazunori Matsuda, Tokushima Bunri University, Japan
Chris Menzel, Nano Science and Technology Institute, USA
Tamal Mukherjee, Carnegie Mellon University, USA
Andrzej Napieralski, Technical University of Lodz, Poland
Ruth Pachter, Air Force Research Laboratory, USA
Michael G. Pecht, University of Maryland, USA
Marcel D. Profirescu, Technical University of Bucharest, Romania
PVM Rao, IIT Delhi, India
Philippe Renaud, Swiss Federal Institute of Technology of Lausanne, Switzerland
Marta Rencz, Technical University of Budapest, Hungary
Siegried Selberherr, Technical University of Vienna, Austria
Sudhama Shastri, ON Semiconductor, USA
Armin Sulzmann, Daimler-Chrysler, Germany
Mathew Varghese, The Charles Stark Draper Laboratory, Inc., USA
Dragica Vasilesca, Arizona State University, USA
Gerhard Wachutka, Technical University of Münich, Germany
Jacob White, Massachusetts Institute of Technology, USA
Thomas Wiegele, BF Goodrich Aerospace, USA
Wenjing Ye, Georgia Institute of Technology, USA
Xing Zhou, Nanyang Technological University, Singapore

Conference Operations Manager

Sarah Wenning, Nano Science and Technology Institute, USA


Joint Electronics and Microsystems Symposia

Reflecting the rapid growth of the Micro and Nano systems fields and the commitment and success of the respective research communities, the Electronics and Microsystems suite of symposia at Nanotech 2008 has evolved into a premier annual event in the Micro and Nano technologies arena.

The MEMS & NEMS , Sensors & Systems , Micro & Nano Fluidics and MSM - Modeling Microsystems symposia will jointly provide a whole and comprehensive forum for a multidisciplinary community, with presentations and topics for discussion ranging from theoretical developments through design and fabrication to industry-oriented applications.

Smarter and smaller and ever more complex systems are being dreamt of, which combine micro and nano system technologies with intelligence, power supply and communication ability, at the same physical scale. Such integrated systems are to be primarily component based and, both the whole and the composites subject to a variety of trends. The increasing systems complexity and multidisciplinary pose strong challenges to the engineers involved in the modelling and fabrication of micro and nanosystems, electronics and wireless communication domains. The Microsystems and Electronics strand will provide valuable networking and interaction opportunities by successfully bringing together the four Symposia above.

World-class researchers in several focused topics of MEMS and NEMS will present their latest research results, allowing cross-disciplinary exchange of knowledge to further advance both technological areas. MEMS is naturally continuing its downsizing into Nanoelectromechanical Systems but at the same time it is indispensable in constructing complete Nano devices and systems. MEMS and Nanotechnology are becoming highly complimentary technologies that will significantly impact various large industries across the globe.

Journal Submissions

Sensors & Transducers

On-line Journal ‘Sensors & Transducers’ (S&T e-Digest)

Selected proceedings papers in the Electronics and Microsystems Track (MEMS & NEMS, Sensors & Systems, Micro & Nano Fluidics symposia, and MSM conference) will be reviewed and invited into a Special Issue of the on-line journal ‘Sensors & Transducers’ (S&T e-Digest).

For consideration into this Special Issue of the on-line journal ‘Sensors & Transducers’, please select the “Submit to ‘Sensors & Transducers’ (S&T e-Digest)” button during the on-line submission procedure.