2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Effects of chain architecture, composition and local stiffness on the controlled assembly and morphology of polymeric blends and composites

Michael Makowski

Michael Makowski

Group Leader, Applied Scientific Computing
PPG Industries R&D

Michael Makowski holds a B.S. Chemistry from the University of Delaware, and a M.S. and Ph.D. in Polymer Science from the University of Akron. During the course of his career, Mike has had the opportunity to work in all of the principle branches of scientific research (academic, industrial and government) and has held positions at Hercules, BF Goodrich, NASA , Cytec Industries, American Cyanamid Company and PPG Industries.

Mike has made technical contributions to numerous projects that have ultimately resulted in the commercialization of new products, new processes or patents in coatings, optical products, water treating, paper and fine chemicals, pharmaceutical intermediates, polymer additives and aerospace materials. Mike’s research interests have included ab initio, classical mechanics, mesoscale methods, Monte Carlo and statistical thermodynamics methods.

Mike’s current responsibilities include overseeing PPG’s scientific computing group whose mission is to apply modeling and simulation methods to projects originating from all business units and to develop new methods to bridge length and time scales to afford predictive capabilities for industrially relevant problems. Mike’s formal training and prior experiences as both a modeling practitioner and experimentalist combine to bridge the gap between results derived from first principles and their practical application.

Speaking in the Polymer Nanotechnology Symposium.

View Confimed Speakers

Back to Conferences & Symposia


Names, and logos of other organizations are the property of those organizations and not of NSTI.
This event is not open to the general public and NSTI reserves the right to refuse admission and participation to any individual.