2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual


D. Monsma
Flexvia, US


A patent for the FlexVia movable tungsten plug for 3D integrated all metal logic and non-volatile memory has been applied for by Harvard University and the inventors Douwe Monsma and Sergio Valenzuela.

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Sessions Sunday Monday Tuesday Wednesday Thursday Authors Keywords

Nanotech 2007 Conference Program Abstract


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