2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Interdiffusion Behavior at the interfaces between deposits of Au Nanoparticles and Electronic Substrates

T-H Kao, J-M Song, I-G Chen, T-Y Dong and W-S Hwang
National Cheng Kung University, TW

Au nano particle, substrate, interdussion, interconnect, XPS

This study investigated the interfacial behavior between thiol-stabilized Au nanoparticle (NP) deposits and the commonly used electronic substrates, Cu, Ni and Ag. After curing at a low temperature of 300oC, continuous Au films with acceptable adhesion strength were obtained. Instead of sintering or agglomerating, curing at 300oC resulted in either entire or partial melting of the deposited suspension because of the drastically reduced melting point of the Au NPs due to the nano-size effect, which was measured to be 230 oC ~270oC. Thus a liquid-solid reaction likely occurred between the NP Au deposits and substrates during the thermal process. The elemental depth profiles examined by X-ray photoelectron spectroscopy (XPS) demonstrated that stoichiometric intermetallic phases, likely Cu3Au and NiAu3, existed respectively at the Au/Cu and Au/Ni interfaces, while a miscible solid solution of nonstoichiometric layer was found to have emerged at the Au/Ag interface. Also, the chemical shifts of binding energies inspected at the reaction layers reflected the alloying behavior at those interfaces.

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