2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Atomic Layer Deposition for Hermetic Polymer Packages

Y. Zhang, R. Yang, S.M. George and Y.C. Lee
University of Colorado, US

hermeticity, polymer, atomic layer deposition

Atomic layer deposition (ALD) can be used to coat a 25-60 nm alumina layer on polymer-based wafer level MEMS or NEMS packages. With this nano-scaled inorganic coating, the polymer packages would become hermetically sealed. This poster will present our latest results in the modeling and experimental characterization of moisture transmission through ALD-alumina layer over a polymer layer. The results confirm the superior moisture resistance. More importantly, they demonstrate the feasibility for a practical approach to test the quality of the ALD coating in an manufacturing environment.

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Nanotech 2007 Conference Program Abstract


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