2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Nanotechnology & The Tin Whisker Phenomenon

J.A. Abys, Y. Zhang, C. Xu and C. Fan
Cookson Electronics Enthone Inc., US

nanotechnology, tin whisker

Compressive stress is widely accepted as the driving force for formation of Tin whiskers. There are several pathways for the build-up of compressive stress in Sn coatings which include: residual stress generated during plating, stress formation due to interfacial reactions between Tin and Copper substrate (i.e. IMC formation), externally applied mechanical stress, and stress due to CTE mismatch between Tin layers and substrate during thermal cycling. In order to prevent or reduce the propensity of whisker growth in Tin deposit, compressive stress has to be eliminated or minimized. This paper will review the various past approaches developed to achieve this objective and introduce a novel approach utilizing nano-particles to mitigate the formation of compressive stress and thus inhibit the propensity for whisker growth.

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Nanotech 2007 Conference Program Abstract


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