2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Silicon Nanoparticles contacted by metal nanogaps for FET applications

K. Wolff and U. Hilleringmann
University of Paderborn, DE

silicon, nanoparticle, nanogap, FET

A low-cost and simple fabrication technique is proposed to prepare a bottom-gate FET applying nanoparticles of silicon (nc-Si). Nanoparticles were contacted by metal nanogaps and characterised subsequently. Conclusions of contacting incorporated into further approaches of application of nanoparticles in FET applications. Therefor the silicon substrate was used as kind of ''gate electrode''. Modulation of conductance of the nc-Si could be attained. Measurements showed reasonable turn-off characteristics and ON/OFF-current ratios. Because of no requirement of a semiconductor substrate in principle and free alignment, design of circuits is possible at all.

Back to Program

Sessions Sunday Monday Tuesday Wednesday Thursday Authors Keywords

Nanotech 2007 Conference Program Abstract


Names, and logos of other organizations are the property of those organizations and not of NSTI.
This event is not open to the general public and NSTI reserves the right to refuse admission and participation to any individual.