2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Process Aware Hybrid SPICE Models Based on TCAD and Silicon Data

Y. Mahotin, V. Moroz, S. Tirumala and X.-W. Lin
Synopsys Inc., US

SPICE model, process aware

This paper describes the methodology for extraction of process dependant hybrid SPICE compact model parameters using calibrated TCAD data and measured Silicon data. Process dependence of electrical curves is, initially, estimated using TCAD data set. The knowledge of process dependence is subsequently utilized to generate device electrical curves centered on typical measured Silicon data. These newly generated device electrical curves are used to extract hybrid SPICE model parameters as explicit functions of process parameter variations.

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