2007 NSTI Nanotechnology Conference and Trade Show - Nanotech 2007 - 10th Annual

Carbon Nanotube-based Thermal Interface Material

K. Ritala
University of Washington, US

thermal management, heat transfer, integrated circuit packaging, thermal interface material

A process has been developed to integrate the high thermal conductivity of carbon nanotubes into a polymer matrix, thus creating a material with high thermal transport properties for laser and IC chip packaging.

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Sessions Sunday Monday Tuesday Wednesday Thursday Authors Keywords

Nanotech 2007 Conference Program Abstract


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