Nanotech 2013 Vol. 2
Nanotech 2013 Vol. 2
Nanotechnology 2013: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)

Modeling & Simulation of Microsystems Chapter 7

Thermal Coupling in Technologies Based on Tri-gate Transistors

Authors: M. Janicki, P. Zajac, M. Szermer, A. Napieralski

Affilation: Lodz University of Technology, Poland

Pages: 520 - 523

Keywords: tri-gate transistors, thermal simulation, many core processors, technology scaling

Abstract:
This paper presents the analyses of static and dynamic thermal coupling among microsystem components for technologies based on tri-gate transistors. Simulations were carried out using Green’s function thermal solver based on power trace data computed from BSIM-CGM predictive technology models. The most important conlusion is that, unlike in the case of standard planar technologies, when scaling down the tri-gate devices the thermal coupling between particular modules might decrease what could be beneficial for performance improvement. The final version of the paper will validate simulation results with measurements of a thermal test ASIC.


ISBN: 978-1-4822-0584-8
Pages: 808
Hardcopy: $209.95