Nanotech 2012 Vol. 2
Nanotech 2012 Vol. 2
Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)

MEMS & NEMS Devices & Applications Chapter 3

Measuring the layer thickness of MEMS using torsional resonance

Authors: N.D. Andrews, J.V. Clark

Affilation: Purdue University, United States

Pages: 207 - 210

Keywords: MEMS, layer thickness, microelectromechanical systems, characterization, test structure

Abstract:
In this work we propose a method to measure the structural layer thickness of MEMS using torsional resonance. The thickness of structures often has measurable influences on the mechanical, thermal, and electrical behaviors. Measurement of layer thickness is often desired for calibration, quality control, and prediction of MEMS performance. This work presents a new model and analysis demonstrating how layer thickness may be measured using the relationship between torsional resonance and cross sectional geometry.


ISBN: 978-1-4665-6275-2
Pages: 878
Hardcopy: $209.95

2015 & Newer Proceedings

Nanotech Conference Proceedings are now published in the TechConnect Briefs

NSTI Online Community