Authors: A. Mapelli, P. Petagna, A. Pezous, P. Renaud
Affilation: CERN, Switzerland
Pages: 235 - 238
Keywords: microfabrication, cooling, particle physics
Local thermal management through silicon microfluidic devices, already under study for possible application in future 3D architectures for high power computing [1,2], is also a good candidate for solving High Energy Physics related issues. It is therefore gaining considerable attention as an innovative technique for cooling particle detectors and their read-out electronics for future tracking devices, where mass and temperature constraints are particularly stringent. At this stage of development an ultra-thin silicon micro-channel cooling plate is placed in direct contact with the silicon surface of the sensor or of the electronic chips. This also suppresses all the problems related to temperature expansion coefficient (CTE) mismatch usually encountered with standard cooling systems of particle physics apparatuses. In the future more integrated solutions might be developed, e.g. using a micro-structured cooling chip as silicon interposer in a 3D architecture. The fabrication of these devices relies on proven micro-fabrication processes: silicon etching, wafer bonding and selective thinning.