Nanotech 2012 Vol. 2
Nanotech 2012 Vol. 2
Nanotechnology 2012: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational (Volume 2)

Packaging, Compound Semiconductors, Power Electronics Chapter 2

Off-Chip Printed Interconnects for Ultrathin Flexible Products
H. Alemohammad, A. Zadeh, J. Sheats, E. Toyserkani
University of Waterloo, CA

nanoCopper based solder-free electronic assembly material
A. Zinn, R. Stoltenberg
Lockheed Martin Space Systems Company Adv. Technol. Center, US

A Novel Method to Maintain Alignment Accuracy in Bonding Process Utilizing Resin as an Adhesive Material
S.-S. Lee, M. Kondo, R. Ishibashi, K. Kinoshita, S. Kishida
Tottori University, JP

Topology Optimization of Ultrasonic Transducers for Microsystem and IC Packaging
J.S. Kim, J.M. Kim, S.I. Lee, E.J. Lim
University of Seoul, KR

Low frequencies anomalies in GaAs FETs
M.A. Iqbal
University of the Punjab, PK

High performance ZnO-based thin film transistor with high-κ gate dielectrics fabricated at low temperature
D.D. Han, J. Cai, W. Wang, L.L. Wang, Y.C. Ren, S.J. Li, Y. Wang, S.D. Zhang
Peking University, CN

Interfacial Studies of CrSi2/ HfO2 thin films as High k Metal Gate Dielectric layer on SiC devices
S. Hullavarad, N. Hullavarad
University of Alaska Fairbanks, US

Voltage Control Of A 3-Ø Self – Excited Induction Generators Using TSC (Thyristor Switched Capacitance)
A. Kumar, A. Chaubey
Infosys Limited, IN

Improved Commutation Control in Switching Regulators for Battery Equalizer Applications
V. Mihov, E. Dinkov
Technical University of Sofia, Branch Plovdiv, BG


ISBN: 978-1-4665-6275-2
Pages: 878
Hardcopy: $209.95