Nanotech 2011 Vol. 2
Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational

Nano & Micro: Computational Methods, Simulation & Software Tools Chapter 9

Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect

Authors: W. Zhao

Affilation: PKU HKUST Shenzhen Institution of IER., China

Pages: 686 - 689

Keywords: interconnect, dispersionless, compact modeling, transients, signal integrity and transmission line theory

Abstract:
In this paper, a compact model for transient response of the dispersionless interconnects is rigorously derived with resistive, inductive and capacitive load terminations. The proposed compact models are verified by the HSPICE simulation result to be highly accurate. And the analysis of signal integrity such as delay and noise for the dispersionless interconnect is also demonstrated by the mans of the developed compact model.

Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect

ISBN: 978-1-4398-7139-3
Pages: 854
Hardcopy: $199.95