Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect

	Nanotech 2011 Vol. 2 Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational Chapter 9: Nano & Micro: Computational Methods, Simulation & Software Tools
	Compact Modeling of Signal Transients and Integrity Analysis for Dispersionless Interconnect
Authors:	W. Zhao
Affilation:	PKU HKUST Shenzhen Institution of IER., CN
Pages:	686 - 689
Keywords:	interconnect, dispersionless, compact modeling, transients, signal integrity and transmission line theory
Abstract:	In this paper, a compact model for transient response of the dispersionless interconnects is rigorously derived with resistive, inductive and capacitive load terminations. The proposed compact models are verified by the HSPICE simulation result to be highly accurate. And the analysis of signal integrity such as delay and noise for the dispersionless interconnect is also demonstrated by the mans of the developed compact model.
ISBN:	978-1-4398-7139-3
Pages:	854
Hardcopy:	$199.95

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