Compliant interconnect technology for power modules in automotive applications

	Nanotech 2011 Vol. 2 Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational Chapter 6: Advanced Packaging and Compound Semiconductors
	Compliant interconnect technology for power modules in automotive applications
Authors:	P. Nenzi
Affilation:	University of Rome la Sapienza, IT
Pages:	430 - 433
Keywords:	ompliant interconnect, wire bonding, power modules, automotive
Abstract:	This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a polymer core that are pressed with a prescribed force over the power dice to establish and maintain stable low-resistance contact. The other end of the wire is bonded to a multi-layer substrate that acts as redistribution layer between dice and as a substrate for control electronics. The resulting power module integrates power and control electronics in a single, compact package with lower wire parasitics than wire-bonding.
ISBN:	978-1-4398-7139-3
Pages:	854
Hardcopy:	$199.95

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