Nano Science and Technology Institute
Nanotech 2011 Vol. 2
Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Chapter 6: Advanced Packaging and Compound Semiconductors

Compliant interconnect technology for power modules in automotive applications

Authors:P. Nenzi
Affilation:University of Rome la Sapienza, IT
Pages:430 - 433
Keywords:ompliant interconnect, wire bonding, power modules, automotive
Abstract:This work will present a new bond-less, economic viable, alternative to wire bonding technology for power dice interconnection in automotive applications. In the presented technology bond wires are replaced by compliant contacts embedded in a polymer core that are pressed with a prescribed force over the power dice to establish and maintain stable low-resistance contact. The other end of the wire is bonded to a multi-layer substrate that acts as redistribution layer between dice and as a substrate for control electronics. The resulting power module integrates power and control electronics in a single, compact package with lower wire parasitics than wire-bonding.
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