 | Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Chapter 6: Advanced Packaging and Compound Semiconductors |
| - | Novel Nanofiber Anisotropic Conductive Films (ACFs) with coupled conductive particles for Ultra Fine Pitch Electronic Packaging Applications |
| | K-L Suk, K.W. Paik |
| | KAIST, KR |
| - | Investigation of Lead-free Nanosolder Reflow and Wettability Property for Electronics/Nanoelectronics Assembly and Packaging |
| | F. Gao, Z. Gu, S. Shina, G. Morose, P. Eliason, R. Farrell |
| | University of Massachusetts Lowell, US |
| - | Effects of Ag and Pd Addition on Mechanical Property and Ion-migration Tolerance in Low Temperature Sintering Bonding Using Ag2O Paste |
| | A. Hirose, T. Itou, T. Ogura |
| | Osaka University, JP |
| - | Compliant interconnect technology for power modules in automotive applications |
| | P. Nenzi |
| | University of Rome la Sapienza, IT |
| - | u-Helix 3D-antenna technology |
| | P. Nenzi |
| | Sapienza - Università di Roma, IT |
| - | Supramolecular Dielectric for Low Voltage Organic Electronics |
| | H.-C.L. Tsui, J. Steinke, A. Campbell |
| | Imperial College London, UK |
| - | Thin film transistors with printed semiconductive oxide channel and silver source-drain electrodes |
| | Z. Chen, Z. Cui |
| | Suzhou Institute of Nano-tech and Nano-bonic, Chinese Academy of Sciences, CN |
| ISBN: | 978-1-4398-7139-3 |
| Pages: | 854 |
| Hardcopy: | $199.95 |
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| Order: | Mail/Fax Form |
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