Nano Science and Technology Institute
Nanotech 2011 Vol. 2
Nanotech 2011 Vol. 2
Nanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Chapter 5: MEMS & NEMS Fabrication, Devices & Applications

Lead Frame Package of MEMS Devices using Wafer-level, Air-gap Structures

Authors:N. Fritz, R. Saha, S.A. Bidstrup Allen, P.A. Kohl
Affilation:Georgia Institute of Technology, US
Pages:314 - 317
Keywords:lead frame packaging, MEMS packaging, polymer air-gap structures
Abstract:This research looks at using a polymer Air-gap structures as a cost efficient method of wafer and chip level packaging MEMS devices for a wide range of applications. The presentation will describe how this style of package could be used for a large range of devices such as hermetic or fluidic, and air-gap processing advancements for the wafer level package. The cavities are then investigated for lead frame package purposes. This investigation uses both modeling and experimental techniques to determine the design and rigidity of the cavity under the molding pressure.
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