Nanotech 2011 Vol. 1
Nanotech 2011 Vol. 1
Nanotechnology 2011: Advanced Materials, CNTs, Particles, Films and Composites

Nanoscale Materials Characterization Chapter 1

Mechanical properties of PECVD Si3N4 thin films with rapid thermal annealing using finite element simulation

Authors: C-Y Chiang, Z-K Huang, K-S Chen

Affilation: National Cheng Kung University, Taiwan

Pages: 20 - 23

Keywords: nanoindentation, FEA, King model, Si3N4

Abstract:
The entire study includes Si3N4 specimen fabrication, material and mechanical characterization, a new physical model derivation, as well as the corresponding finite element analysis (FEA) and simulations. Nevertheless, the standard method used for nanoindentation were developed primarily for monolithic material. In this study, finite element analysis (FEA) was used to simulate the effect of residual stress on indentation test and develop an improved technique that nanoindentation will be widely applicable.

Mechanical properties of PECVD Si3N4 thin films with rapid thermal annealing using finite element simulation

ISBN: 978-1-4398-7142-3
Pages: 882
Hardcopy: $199.95