MEMS & NEMS Devices

Papers:

Mechanical Robustness of FPA in a-Si Microbolometer with Fine Pitch

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Uncooled microbolometer has the various applications in many commercial and military applications. Among many sensor materials, amorphous Si have been widely used as sensor materials for their good TCR (Temperature Coefficient of Resistance), mechanical strength, [...]

Journal: TechConnect Briefs
Volume: 2, Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Published: June 21, 2010
Industry sector: Sensors, MEMS, Electronics
Topic: MEMS & NEMS Devices, Modeling & Applications
ISBN: 978-1-4398-3402-2