 | Nanotech 2010 Vol. 2
Nanotechnology 2010: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational
Chapter 3: Micro & Nano Reliability |
| - | Advanced Virtual Qualification Methods to Reduce the Time-to-Market of Microelectronic Assemblies |
| | M.H. Shirangi, M. Koyuncu, J. Keller, B. Michel |
| | Bosch Mahle TS GmbH, DE |
| - | In-situ MEMS Testing |
| | A. Dommann, A. Neels, A. Schifferle, E. Mazza |
| | CSEM, CH |
| - | A Novel In-situ Force Measurement Method for Real Solder Joints Fatigue Evaluation |
| | M. Roellig, R. Metasch, K. Meier |
| | Fraunhofer Institute for Non-Destructive Testing, DE |
| - | A Multiscale Modeling Approach for Microelectronic Packaging Applications |
| | N. Iwamoto, O. Hölck, S. Noijen, B. Wunderle, S. Todd |
| | Honeywell Specialty Materials, US |
| - | Influence of moisture on humidity sensitive material parameters of microelectonic relevant polymers |
| | H. Walter, E. Dermitzaki, B. Wunderle, B. Michel |
| | Fraunhofer IZM, DE |
| - | Advanced In- and Out-off plane High Resolution X-ray Strain Analysis on MEMS |
| | A. Neels, A. Dommann |
| | CSEM, CH |
| - | Networking in Micro/Nano Reliability Research Encouraged by EUCEMAN, the European Center for Micro- and Nanoreliability |
| | B. Michel, J. Hammacher, T. Winkler, E. Kaulfersch |
| | Fraunhofer ENAS, DE |
| ISBN: | 978-1-4398-3402-2 |
| Pages: | 862 |
| Hardcopy: | $189.95 |
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| Order: | Mail/Fax Form |
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